Electronic
Packaging
design@progressinc.com
Electronic
Packaging design includes packaging of enclosures, mother and daughter
board definition, thermal design and airflow/cooling.
Printed circuit layout and schematic capture services. Rack mounted enclosures and custom enclosures; both metal and plastic molded. Designed with consideration for EMI/RFI requirements.
Our
engineers can
provide project management for your designs using
our expertise in
manufacturing technologies; surface mount and
thru-hole, rigid, flexible and rigid-flex
printed circuitry as well as advanced interconnect technologies.
Our capabilities include:
- Chassis
Design
- Printed
Circuit Board Layout
- Schematic
Capture
- Thermal
Analysis
- Mil-Spec
- Bell Core
- Commercial
Standards
- Flexible
Circuit Design and Layout
- Harness and
Cabling
- Project
Management
- Design Documentation
